The cloud signing event for key investment projects in Tianjin Binhai New Area was held. A total of 82 key projects were signed, with a total investment of about 58 billion yuan.
Among them, Yuanxu Semiconductor Technology Co., Ltd. (hereinafter referred to as: Yuanxu Semiconductor) plans to set up a wholly-owned subsidiary in Tianjin High-tech Zone as the main body of the project, and build a third-generation semiconductor high-end display chip RD center and a vertically integrated manufacturing plant. The total investment of the project is 1 billion yuan, and the annual output value after reaching production is not less than 1 billion yuan.
It is reported that Yuanxu Semiconductor was established in May 2014. It is a high-tech enterprise engaged in the research and development, production and sales of semiconductor optoelectronic materials and chip products. Relying on the third-generation semiconductor chip system design, nano-semiconductor microstructure technology, advanced packaging technology and other technologies, the company business scope covers high-efficiency and high-power GaN UV antivirus chip modules, GaN semiconductor integrated display chip modules, Transdermal drug delivery biochips and other fields.
In December 2021, Yuanxu Semiconductor was approved as Weifang One Enterprise One Technology Center and Weifang Key Laboratory of New Micro-Nano Substrate Chips. Before that, Yuanxu Semiconductor already owned Weifang Substrate Micro-Nano Processing Engineering Laboratory and ;Weifang Optoelectronic Materials and Device Engineering Technology Research Center. This means that Yuanxu Semiconductor now has 4 municipal-level technology research and development platforms.
In addition, Yuanxu Semiconductor has also established a Nano Optoelectronics Research Center with the Wuxi Research Institute of Tsinghua University, and established a photoelectric technology joint laboratory with Dalian University of Technology. Conduct in-depth industry-university-research cooperation in the fields of needles and other fields; signed a strategic agreement on cooperative development of High Efficiency and High Power Aluminum Gallium Nitride Deep Ultraviolet Antivirus Chip with BOLB Company of the United States, on the research and development of high efficiency and high power aluminum gallium nitride deep ultraviolet LED modules, In-depth cooperation in the industrialization of application products.