Heat dissipation of high-power LED products
Due to the limitation of semiconductor light-emitting diode chip technology, the photoelectric conversion efficiency of LEDs has yet to be improved, especially for high-power LEDs. Because of their high power, approximately 60% of the electrical energy will become heat release (with the development of semiconductor technology. The photoelectric conversion efficiency will gradually increase. This requires the end customer to do a good job of heat dissipation when using high-power LED products to ensure that the high-power LED products work properly.
1. Heat sink requirements
Appearance and Material: If the seal of the finished product is not high enough, direct convection can occur with the outside air environment. It is recommended to use finned aluminum or copper heat sinks.
2. Effective heat dissipation surface area:
For 1W high-power LED white light (other colors are basically the same), we recommend the effective heat sink surface area ≥ 50-60 cm 2 . For 3W products, it is recommended that the total effective heat sink surface area of the heat sink be ≥150 square centimeters. The higher power conditions and test results will increase. Try to ensure that the heat sink temperature does not exceed 60°C.
3. connection method:
When the high-power LED substrate and the heat sink are connected, ensure that the two contact surfaces are flat and in good contact. To enhance the degree of bonding between the two contact surfaces, it is recommended to coat the bottom of the LED substrate or the surface of the heat sink with a layer of thermal grease (thermal conductivity of the thermal grease). ≥3.0W/mk), thermal grease is required to be coated evenly and properly, and then screwed and fixed.
