Led product prices continue to decline, technological innovation has become a powerful tool to improve product performance, reduce costs and optimize the supply chain. Under the pressure of terminal price, the market forces led enterprise technology upgrade, and further promote the application and popularization of new technologies.
Technological innovation is always an important weight for enterprises to increase product value. On the one hand, CSP chip-level packaging, flip-chip led, de-power module technology gradually mature and realize large-scale production, has attracted extensive attention of the industry, the next step is to improve the cost performance; On the other hand, the markets for EMC, cob, and high-voltage led continue to explode and future growth will focus on segments.
1. CSP chip level package
The most popular led technology mentioned is CSP. Csp has attracted much attention because of the industry's demand for miniaturization and cost performance improvement. At present, CSP is gradually being used in mobile flash, display backlight and other fields.
2. de - power module
In recent years, " de - power" has developed in full swing, so what is " de - power"? " de - power" is the power supply built - in, reduce electrolytic capacitors, transformers and other parts of the device, the drive circuit and led lamp bead share a substrate, realize the high integration of drive and led light source. Compared with the traditional led, the power-off scheme is simpler, and the automatic and batch production is easier; Meanwhile, that volume can be reduce and the cost can be reduced.
3, flip-chip led technology
Flip chip + chip level package is a perfect combination. Flip - chip led with high density, high current advantage, in recent two years has become the hot spot of led chip enterprise research and led industry development direction.
4. EMC package
Emc refers to the epoxy molding compound, with high heat resistance, uv resistance, high integration, high current, small volume, high stability and other characteristics, in the field of demanding heat dissipation bulb lamp, against uv requirements of outdoor lamps and lanterns and high stability requirements of backlight field has outstanding advantages.
5. high voltage led package
In fact, the principle of high-voltage chip is to use the concept of fragmentation, the larger chip is decomposed into small chips with high light efficiency and uniform light emission, and through the semiconductor process technology integrated together, make full use of the chip area, more effectively achieve the purpose of brightness enhancement. From the point of view of the whole lamp ( such as street lamp ), high voltage chip with IC power supply, power supply under the voltage difference becomes smaller, in addition to increase the service life, also can reduce the cost of the system.
6. cob integrated package
Cob integrated light source is widely used in the field of commercial lighting, because it is easier to realize the characteristics of dimming, anti - glare, high brightness and so on. it can solve the problems of color difference and heat dissipation, and is favored by many led packaging manufacturers.