Technology
a) Cleaning: Ultrasonic cleaning PCB or LED brackets, and drying.
b) Mounting: After the silver electrode is prepared on the bottom electrode of the LED die (large wafer), the expanded wafer (large wafer) is placed on the acupuncture table and the dies are placed under a microscope with a stab pen. One by one is mounted on the corresponding pads of the PCB or LED support and then sintered to cure the silver paste.
c) Pressure welding: The electrode is connected to the LED die with an aluminum wire or gold wire welder for current injection. The LED is directly mounted on the PCB, generally using an aluminum wire bonder. (The production of white light TOP-LED requires a gold wire welder)
d) Package: Protect the LED die and bond wire with epoxy by dispensing. Dispensing on the PCB board has strict requirements on the shape of the colloid after curing, which is directly related to the brightness of the finished product of the backlight source. This process will also take on the task of phosphor (white LED).
