The Toray Group has successfully developed a laser transfer release material that enables high-speed alignment of LED chips, a bonding material that simplifies the LED and wiring process, and a substrate side wiring material that contributes to the size of displays , these materials will greatly improve the display performance of Micro LED (micron light-emitting diode) displays.
MicroLED displays not only have excellent performance in terms of brightness, color gamut, contrast ratio and reliability, but also use LEDs with high luminous efficiency as light sources, which reduces power consumption and is expected to become a new generation of displays with high performance and low environmental load.
On the other hand, in order to achieve full popularization at an early date and strive to reduce manufacturing costs, it is necessary to realize a technology for arranging a plurality of micro LED chips accurately and at high speed.
Toray has successfully developed a laser transfer material that enables high-speed arrangement of multiple LED chips at arbitrary positions on the substrate during the manufacturing process of displays. The material is organically used in combination with the laser transfer device and inspection device promoted by Toray Engineering, which not only speeds up the manufacturing of Micro LEDs, but also selectively configures the color tone of each LED chip, thereby ensuring the uniform color of the display.
In addition, the technology of RAYBRID, a photosensitive conductive material, has been improved, and binding material and substrate side wiring material have been developed.
Binding material is a material used to connect the electrodes of the LED chip to the circuit on the substrate. Compared with the past, it can not only connect quickly in a low temperature and low voltage environment, but also solves the problem of difficult replacement of defective LED chips in the past. Helps improve manufacturing yields.
The substrate side wiring material is a material that transmits signals from the surface to the back of the substrate. The wiring is completed through a simple process, and multiple displays can be seamlessly connected to achieve large-scale.
So far, Toray has mass-produced the following materials for Micro LED displays, such as insulating materials used for wiring formation of LED chips, and black materials with high contrast that contribute to purer blacks in displays , The temporary bonding material used in the process of thinning the substrate of the LED chip or peeling off. In the future, it is also planned to include retaining wall materials that take into account high luminous purity and high brightness into the product lineup.
Through this research and development, the materials used for Micro LED displays have been expanded, and in combination with Toray Engineering manufacturing and inspection equipment, the overall solution required for the manufacture of Micro LED displays has been provided, contributing to the realization of mass production of Micro LED displays.