At present, most of the commercialized LED chip packaging is a positive packaging structure. However, with the continuous improvement of output power, failure problems such as large light attenuation that restrict the development of high-power LEDs have emerged one after another.
In order to improve the common problems such as easy breakage of gold wires and poor heat dissipation of front-mounted packaged LEDs, researchers in the industry have successively invented vertical structure LEDs and flip-chip LEDs.
Vertical structure LEDs and flip-chip LEDs have their own advantages and disadvantages. Who can better represent the future of LEDs?
Sang Jian believes that Hongli Display current technical breakthrough is mainly flip-chip COB. If the packaging structure of the display module is innovated, so that the vertical structure LED does not use the wire bonding process, it may be expected to be greatly promoted; but if it is still the current conventional structure, the vertical chip technology not only needs to transfer the solid crystal, but also needs the bonding wire. It increases the difficulty of the process. Hongli Display, as a packaging factory, does not highly respect this technology.
Ruifeng Optoelectronics Pei Xiaoming said that performance and cost are the two most important factors. In terms of performance, vertical structure LEDs have advantages in heat dissipation efficiency, etc. However, in terms of cost, vertical structure LEDs are inferior to flip-chip LEDs in terms of process difficulty, equipment investment, and production efficiency.
Absen Shi Changjin has great expectations for vertical structure LEDs. He believes that silicon carbide substrates, silicon substrates, and sapphire substrates each have their own advantages and disadvantages. Among them, vertical silicon substrate chips have advantages that the other two substrate chips cannot match, such as optical reactions. At the same time, the industrialization of vertical silicon substrate chips is faster than the other two substrate technologies, which is of great help for enterprises to increase their scale and carry out marketing.
Dinghua Xintai He Zhongliang believes that flip-chip LED is a trending technology, and from the current cost perspective, vertical structure LED is more worthy of praise. The price of the vertical chip is 1/2 of that of the flip chip, and the use of the vertical chip packaging method can greatly reduce the cost of the substrate, welding and sorting. Therefore, when the price of flip-chip LEDs is at a high level, vertical chips are more in line with market demand.